243页 | 重磅！2020年中国物联网产业全景图谱
本帖最后由 168主编 于 2020-1-11 11:14 编辑近日，物联网智库正式发布《中国物联网产业全景图谱报告2020》（以下简称“报告”），据悉，这是物联网智库连续第4年推出物联网产业全景图谱。该报告结合上一版本的物联网产业生态图谱，对产业链各环节核心企业和机构继续进行调研，对原有图谱中细分内容进行更新，希望业界能够“一张图了解物联网产业全貌”。 报告指出，“下沉”和“扩展”是今年物联网市场的主流方向，同时也是未来整个物联网产业发展的趋势。同时。对于物联网整体而言，需要处理各种不同类型的海梁的数据，进而催生了不同的芯片需求，5G芯片、AI芯片、量子芯片等成了新的增长点。 以下为报告节选： http://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270325a.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270325b.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270325c.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270325d.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270335e.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270335f.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703360.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703461.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703462.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703463.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703400.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703501.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703502.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703503.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703604.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703605.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703606.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703707.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703708.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703709.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270370a.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270380b.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270380c.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270380d.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270390e.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f8270390f.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703910.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703a11.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703a12.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703a13.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703b14.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703b15.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703b16.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703b17.jpghttp://www.cbdio.com/image/attachement/jpg/site2/20200110/f42853157e261f82703c18.jpg来源：物联网智库
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